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Ostar Observation Lead (Pb) Free Product - RoHS Compliant SFH 4730, SFH 4740
SFH 4730
SFH 4740 SFH 4740
SFH 4730 * Schwarzer Rahmen zur Streulichtminimierung * 3 W optische Leistung SFH 4740 * Weier Rahmen fur hohe Lichtleistung * 3.6 W optische Leistung Wesentliche Merkmale * * * * * * Aktive Chipflache 2.1 x 5.4 mm2 max. Gleichstrom 1 A niedriger Warmewiderstand (2.8 K/W) Emissionswellenlange 850 nm ESD-sicher bis 2 kV nach JESD22-A114-B Augensicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 mussen beachtet werden.
SFH 4730 * Black frame to minimize scattered light * 3 W optical power SFH 4740 * White frame to achieve high optical power * 3.6 W optical power Features * * * * * * Active chip area 2.1 x 5.4 mm2 max. DC-current 1 A Low thermal resistance (2.8 K/W) Spectral emission at 850 nm ESD save up to 2 kV acc. to JESD22-A114-B Eye safety precautions given in IEC 60825-1 and IEC 62471 have to be followed.
Anwendungen * * * * Infrarotbeleuchtung fur CMOS Kameras Uberwachungssysteme IR-Datenubertragung Fahrer-Assistenz Systeme
Applications * * * * Infrared Illumination for CMOS cameras Surveillance systems IR Data Transmission Driver assistance systems
Typ Type SFH 4730 SFH 4740
1)
Bestellnummer Ordering Code Q65110A5452 Q65110A6190
Strahlstarke1) (IF = 1A, tp = 20 ms) Radiant intensity1) e (mW/sr) typ.1000 typ.1200
gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr.
2007-08-13
1
SFH 4730, SFH 4740
Grenzwerte Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrschichttemperatur Junction temperature Sperrspannung Reverse voltage Vorwartsgleichstrom, TB1) 85 C Forward current Stostrom, tp < 1 ms, D = 0.2, TB 85 C Surge current Leistungsaufnahme, TB 85 C Power consumption Thermische Verlustleistung, TB 85 C Thermal power-dissipation Warmewiderstand Sperrschicht / Bodenplatte Thermal resistance Junction / Base plate
1)
Symbol Symbol
Wert Value - 40 ... + 125 + 145 0.5 1 2 24 21 2.8
Einheit Unit C C V A A W W K/W
TB, op , TB, stg TJ VR IF IFSM Ptot Pth RthJB
TB = Temperatur auf der Ruckseite der Metallkernplatine / Temperature at the backside of the base plate.
2007-08-13
2
SFH 4730, SFH 4740
Kennwerte (TB = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 1 A, tp = 10 ms Schwerpunkts-Wellenlange der Strahlung Centroid wavelength IF = 1 A, tp = 10 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 1 A, tp = 10 ms Abstrahlwinkel Half angle Abmessungen der aktiven Chipflache1) Dimension of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, IF = 1 A, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 1 A, RL = 50 Durchlassspannung Forward voltage IF = 1 A, tp = 100 s Gesamtstrahlungsfluss Total radiant flux IF = 1 A, tp = 100 s SFH 4730 SFH 4740 Temperaturkoeffizient von Ie bzw. e Temperature coefficient of Ie or e IF = 1 A, tp = 10 ms Temperaturkoeffizient von VF Temperature coefficient of VF IF = 1 A, tp = 10 ms Temperaturkoeffizient von Temperature coefficient of IF = 1 A, tp = 10 ms
1)
Symbol Symbol peak
Wert Value 850
Einheit Unit nm
centroid
845
nm
40
nm
60 2.1 x 5.4 10
Grad deg. mm ns
LxB LxW tr , tf
VF
18 ( 24)
V
e e TCI
3 3.6 - 0.5
W W %/K
TCV
-2
mV/K
TC,centroid
+ 0.2
nm/K
Die aktive Chipflache besteht aus 10 einzelnen Chips mit je 1 x 1 mm. The active chip area consists of 10 single chips with 1 x 1 mm each.
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3
SFH 4730, SFH 4740
Strahlstarke1) e Radiant Intensity1) e Bezeichnung Parameter Symbol
SFH 4730-EA
Werte Values
SFH 4730-EB SFH 4740-EB SFH 4740-FA
Einheit Unit
Strahlstarke Radiant Intensity IF = 1 A, tp = 20 ms
1)
e min e max
630 1000
800 1250
800 1250
1000 1600
mW/sr mW/sr
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 1.6:1) Only one group in one packing unit (variation lower 1.6:1)
Abstrahlcharakteristik Radiation Characteristics Irel = f ()
40 30 20 10 0
OHL01660
1.0
50
0.8
0.6 60 0.4 70 0.2 80 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 0
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4
SFH 4730, SFH 4740
Relative spektrale Emission Relative Spectral Emission Irel = f (), TB = 25 C
100 %
OHL01714
Durchlassstrom Forward Current IF = f (VF), TB = 25 C, Single pulse, tp = 100 s
IF
10 1 A
OHF02930
Relativer Gesamtstrahlungsfluss Relative Total Radiant Flux e/e(1000mA) = f (IF), TB = 25 C, Single pulse, tp = 100 s
e
101
OHF02931
e (1000 mA)
100
10 0
I rel 80
5
60
10-1
40
10 -1
5
10-2
20
5
0 700
750
800
850
nm 950
10 -2 10
12
14
16
18
20 V 22
10-3 1 10
5 10 2
5 10 3
mA 10 4
VF
IF
Max. zulassiger Durchlassstrom Max. Permissible Forward Current IF = f (TB), RthJB = 2.8 K/W
1200 mA
OHF02973
Zulassige Impulsbelastbarkeit Permissible Pulse Handling Capability IF = f (tp), TB 85 C, Duty cycle D = parameter
2.3 IF A 2.1 2.0 1.9
OHF02974
IF
D = TP
t
tP
IF T
800
1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0
D=
0.005 0.01 0.02 0.05 0.1 0.2 0.35 0.5 1
600
400
200
0
0
20
40
60
80
100 C 130
TB
0.9 -6 -5 -4 -3 -2 -1 0 10 10 10 10 10 10 10
tp
s 102
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5
SFH 4730, SFH 4740
SMD NTC Thermistor mit Nickel Barrier Termination, Typ 0603 SMD NTC Thermistor with Nickel Barrier Termination, Type 0603 No. of R/T characteristics EPCOS 8502 / A01 R25 [] 10k 5% B25/50 [K] 3940 B25/85 [K] 3980 B25/100 [K] 4000
Typische Thermistor Kennlinie Typical Thermistor Graph
R
10 6
OHL02893
10 5 5
10 4 5
10 3 5
10 2 -60
-20
20
60
100
C 160
TNTC
(www.epcos.com)
2007-08-13
6
SFH 4730, SFH 4740
Mazeichnung und Ersatzschaltbild Package Outlines and equivalent circuit diagram Frame color: black for SFH4730 white for SFH4740
Mae in mm (inch) / Dimensions in mm (inch).
Verwendeter Stecker / Used male connector on board: ERNI male connector SMD 214012, 4-pins (www.erni.com) Empfohlene Gegenstecker / Recommended female connector for power supply: ERNI female connector SMD 214025, 4-pins (www.erni.com)
Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-08-13 7

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